Thermal Modelling of Silicon Photonic Ring Modulator with Substrate Undercut
نویسندگان
چکیده
Ring modulators for silicon photonic (SiPho) optical transceivers are extremely thermally sensitive and require thermal tuning stable operation. This is achieved with integrated heaters in this work two aspects of the investigated: firstly, how to model heater-waveguide system a SiPho ring modulator. Secondly, improve energy efficiency by adapting design order minimize power consumed heater. Silicon substrate undercut (UCUT) done achieve out-of-plane isolation prevent heat flow directly into Si below device. Introducing UCUT increases heater ( $\eta _{h}$ ) factor X3.08. It shown that influence cross section on can be neglected, only total area metals significantly behaviour. Comparison between electro-thermal pure simulation shows very similar Finally, causes an increase time constant X3.68.
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ژورنال
عنوان ژورنال: Journal of Lightwave Technology
سال: 2022
ISSN: ['0733-8724', '1558-2213']
DOI: https://doi.org/10.1109/jlt.2022.3162987